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claimed internal components iphone 6 beginning surface increasing frequency less 2 months until launch. in line developments, new set of photos [google translate] shared nowhereelse.fr reveal appears bare logic board of iphone 6, 4.7-inch model.
according nowehereelse.fr, source shared photos of parts claims iphone 6 include support both near field communication (nfc) , faster 802.11ac wi-fi, although neither of claims can confirmed photos themselves. nfc iphone has been rumored years, has yet come fruition , rumors once again split whether iphone 6 include technology. 802.11ac seems natural upgrade iphone appropriate chips available.
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the logic board bears number of similarities corresponding parts other iphones, although part includes longer piece extending across top of device. given larger body size of iphone 6, however, unsurprising internal components see changes design , layout.
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overlay of logic board , rear shell
screw holes in board appear line ones seen in recent leaks of claimed rear shell parts iphone 6, indicating indeed same device.
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annotation of iphone 6 logic board component locations
(click larger)
with photos showing bare printed board , no chips or other components installed, difficult tell new information part, although locations of components can identified based on similarities other iphone logic boards.
iphone 6 expected see similar launch timeframe in recent years, september media event introduction followed launch shortly after. while 4.7-inch model expected follow timeline, larger 5.5-inch model said still in flux , may not debut until several months later.
article link: bare iphone 6 logic board surfaces, claimed support nfc , 802.11ac wi-fi
am 1 who's more excited 802.11ac instead of nfc?
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